Touch panel, method for fabricating the same, display panel, and display device

ABSTRACT

This disclosure discloses a touch panel, a method for fabricating the same, a display panel, and a display device, and the touch panel includes: a substrate; touch electrodes on the substrate, wherein the touch electrodes include a first electrode in a first direction, and a second electrode perpendicular to the first direction, and the first electrode includes a plurality of first electrode blocks; and a plurality of bridge structures on the substrate, configured to electrically connect adjacent first electrode blocks of the plurality of first electrode blocks, wherein each of the plurality of bridge structures includes: at least two metal bridge points, and an electrode connection bridge and a first protection layer overlying the at least two metal bridge points successively, wherein the electrode connection bridge includes via holes corresponding to the metal bridge points in a one-to-one manner.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application No.201810779123.8, filed with the Chinese Patent Office on Jul. 16, 2018,the content of which is hereby incorporated by reference in itsentirety.

FIELD

This disclosure relates to the field of display technologies, andparticularly to a touch panel, a method for fabricating the same, adisplay panel, and a display device.

BACKGROUND

A touch panel includes metal wires, electrode connection bridges, aconnection bridge protection layer, touch electrodes, a touch electrodeprotection layer, etc.

SUMMARY

Embodiments of the disclosure disclose a touch panel, a method forfabricating the same, a display panel, and a display device.

In order to attain this object, the embodiments of the disclosureprovide the following technical solutions.

An embodiment of the disclosure provides a touch panel including:

a substrate;

touch electrodes on the substrate, wherein the touch electrodes includea first electrode in a first direction, and a second electrodeperpendicular to the first direction, and the first electrode includes aplurality of first electrode blocks; and

a plurality of bridge structures, on the substrate, configured toelectrically connect adjacent first electrode blocks of the plurality offirst electrode blocks, wherein each of the plurality of bridgestructures includes: at least two metal bridge points, and an electrodeconnection bridge and a first protection layer overlying the at leasttwo metal bridge points successively, wherein the electrode connectionbridge includes via holes corresponding to the metal bridge points in aone-to-one manner, and the pattern of an orthographic projection of thefirst protection layer on the substrate has the same shape as a patternof an orthographic projection of the electrode connection bridge on thesubstrate; and two of the plurality of first electrode blocksrespectively at two ends of each electrode connection bridge runrespectively through the via holes of the first protection layer and thevia holes of the electrode connection bridge, and are electricallyconnected respectively with the metal bridge points.

In the touch panel above, at least two metal bridge points are at theunderlying layer of each of the plurality of bridge structures, theelectrode connection bridge and the first protection layer overlie themetal bridge points successively, both the electrode connection bridgeand the first protection layer are arranged with the via holescorresponding to the metal bridge points, and the two electrode blocksat the two ends of each electrode connection bridge run respectivelythrough the via holes of the first protection layer and the via holes ofthe electrode connection bridge, and are electrically connectedrespectively with the metal bridge points; and furthermore the twoelectrode blocks at the two ends of each electrode connection bridge canbe electrically connected with each other through the metal bridgepoints and the electrode connection bridge. Furthermore in this touchpanel, since the pattern of the orthographic projection of the electrodeconnection bridge n the substrate has a same shape as the pattern of theorthographic projection of the first protection layer on the substrate,the electrode connection bridge and the first protection layer can bepatterned using a same mask to thereby dispense with one mask so as tolower the cost of fabricating the touch panel.

In some embodiments, the touch panel further includes a secondprotection layer on the touch electrodes, and a pattern of anorthographic projection of the second protection layer on the substratecoincides with a pattern of an orthographic projection of the touchelectrodes on the substrate.

In some embodiments, the touch panel further includes metal wires at asame layer as the metal bridge points.

In some embodiments, a wire electrode layer at a same layer as the touchelectrodes and a wire protection layer at a same layer as the secondprotection layer overlie the metal wires successively.

In some embodiments, the touch panel further includes a third protectionlayer with a full layer structure on the second protection layer.

In some embodiments, the pattern of the orthographic projection of thefirst protection layer on the substrate covers the pattern of theorthographic projection of the electrode connection bridge on thesubstrate.

In some embodiments, a contour of an edge of the first protection layercompletely covers a contour of an edge of the electrode connectionbridge.

In some embodiments, the wire electrode layer and the wire protectionlayer each has an opening in a bonding area of the metal wires.

In some embodiments, the electrode connection bridge and the touchelectrodes are Indium Tin Oxide electrodes, and the first protectionlayer and the second protection layer are insulating organic layers.

In some embodiments, a size of each of the via holes of the firstprotection layer is less than a size of each of the metal bridge points,and a size of each of the via holes of the electrode connection bridgeis less than the size of each of the metal bridge points.

The embodiments of the disclosure provide a display panel including thetouch panel according to any one of the embodiments above.

The embodiments of the disclosure provide a display device including thedisplay panel according to the embodiments above.

The embodiments of the disclosure provide a method for fabricating thetouch panel according to any one of the embodiments above, the methodincluding:

forming a metal layer on the substrate, and forming the metal bridgepoints of each of the plurality of bridge structures in a firstpatterning process;

forming a first electrode layer on the metal layer, and forming theelectrode connection bridge of each of the plurality of bridgestructures in a second patterning process;

forming a first organic insulating layer on the first electrode layer,and forming the first protection layer of each of the plurality ofbridge structures in a third patterning process, wherein a same mask isused in the third patterning process and the second patterning process;and

forming the touch electrodes on the first organic insulating layer.

In some embodiments, the forming the touch electrodes on the firstorganic insulating layer includes:

forming a second electrode layer on the first organic insulating layer,forming a second organic insulating layer on the second electrode layer,and patterning the second organic insulating layer in a fourthpatterning process to form a same pattern as the touch electrodes to beformed; and

etching the second electrode layer using the second organic insulatinglayer as a mask to form the touch electrodes.

In some embodiments, metal wires are further formed in the firstpatterning process.

In some embodiments, the method further includes:

forming a wire protection layer overlying the metal wires in the fourthpatterning process; and

etching the second electrode layer using the second organic insulatinglayer as a mask to further form a wire electrode layer overlying themetal wires.

In some embodiments, patterning the second organic insulating layer in afourth patterning process to form a same pattern as the touch electrodesto be formed includes:

patterning the second organic insulating layer in a fourth patterningprocess to form a same pattern as the touch electrodes to be formed tothereby form a second protection layer;

wherein etching the second electrode layer using the second organicinsulating layer as a mask to form the touch electrodes includes:

etching the second electrode layer using the second protection layer asa mask to form the touch electrodes.

In some embodiments, after forming the touch electrodes on the firstorganic insulating layer, the method further includes: forming a thirdprotection layer with a full layer structure on the second protectionlayer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of metal bridge points andmetal wires in a touch panel according to the embodiments of thedisclosure.

FIG. 2 is a schematic structural diagram of the metal bridge points, themetal wires, and electrode connection bridges in the touch panelaccording to the embodiments of the disclosure.

FIG. 3 is a schematic structural diagram of a touch panel according toan embodiments of the disclosure.

FIG. 4 is a schematic structural diagram of the touch panel in FIG. 3 ina sectional view along A-A.

FIG. 5 is a schematic structural diagram of the touch panel in FIG. 3 ina sectional view along B-B.

FIG. 6 is a schematic structural diagram of the touch panel in FIG. 3 ina sectional view along C-C.

FIG. 7 is a schematic structural diagram of the touch panel in FIG. 3 ina sectional view along D-D;

FIG. 8 is a schematic structural diagram of a part of the touch panel ina sectional view according to the embodiments of the disclosure afterthe metal bridge points are formed.

FIG. 9 is a schematic structural diagram of a part of the touch panel ina sectional view according to the embodiments of the disclosure after afirst electrode layer is formed.

FIG. 10 is a schematic structural diagram of a part of the touch panelin a sectional view according to the embodiments of the disclosure aftera photo-resist layer is formed on the first electrode layer.

FIG. 11 is a schematic structural diagram of a part of the touch panelin a sectional view according to the embodiments of the disclosure afterthe metal connection bridges are formed.

FIG. 12 is a schematic structural diagram of a part of the touch panelin a sectional view according to the embodiments of the disclosure aftera first protection layer is formed.

FIG. 13 is a schematic structural diagram of a part of the touch panelin a sectional view according to the embodiments of the disclosure aftera second electrode layer is formed.

FIG. 14 is a schematic structural diagram of a part of the touch panelin a sectional view according to the embodiments of the disclosure aftera second protection layer is formed on the second electrode layer.

FIG. 15 is a flow chart of a method for fabricating the touch panelaccording to the embodiments of the disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The touch panel is usually fabricated by patterning a metal layer, afirst electrode layer (e.g. a first Indium Tin Oxide layer, ITO1), afirst protection layer (e.g. a first overcoat layer, OC1), a secondelectrode layer (e.g. a second Indium Tin Oxide layer, ITO2), and asecond protection layer (e.g. a second overcoat layer, OC2) respectivelyusing five masks at a high development cost.

The technical solutions according to the embodiments of the disclosurewill be described below clearly and fully with reference to the drawingsin the embodiments of the disclosure. Apparently the embodiments to bedescribed are only a part but all of the embodiments of the disclosure.Based upon the embodiments here of the disclosure, all of otherembodiments which can occur to those ordinarily skilled in the artwithout any inventive effort shall come into the scope of the disclosureas claimed.

Reference will be made to FIG. 1 to FIG. 15.

As illustrated in FIG. 1 to FIG. 5, a touch panel according to theembodiments of the disclosure includes:

a substrate 1;

touch electrodes on the substrate 1, where the touch electrodes includea first electrode 51 in a first direction (as indicated by the dottedarrow in FIG. 3) and a second electrode 52 perpendicular to the firstdirection, and the first electrode 51 includes a plurality of firstelectrode blocks 510 in the first direction; and

a plurality of bridge structureson the substrate 1, configured toelectrically connect adjacent first electrode blocks 510 of theplurality of first electrode blocks 510, where of the plurality ofbridge structures includes: at least two metal bridge points 2, and anelectrode connection bridge 3 and a first protection layer 4 overlyingthe at least two metal bridge points 2 successively, where the electrodeconnection bridge 3 includes via holes corresponding to the metal bridgepoints 2 in a one-to-one manner, and a pattern of an orthographicprojection of the first protection layer 4 on the substrate 1 has a sameshape as a pattern of an orthographic projection of the electrodeconnection bridge 3 on the substrate 1; and two of the plurality offirst electrode blocks 510 respectively at two ends of each electrodeconnection bridge 3 run respectively through via holes of the firstprotection layer 4 and the via holes of the electrode connection bridge3, and are electrically connected respectively with the metal bridgepoints 2. In some embodiments, for example, each of the plurality ofbridge structures includes two metal bridge points 2, which cancorrespond respectively to the two ends of the electrode connectionbridge 3, and the two first electrode blocks 510 at the two ends of theelectrode connection bridge 3 can run respectively through two via holesof the first protection layer 4, and the corresponding two via holes ofthe electrode connection bridge 3, and be electrically connectedrespectively with the two metal bridge points 2.

In the touch panel above, at least two metal bridge points 2 arearranged at the underlying layer of each of the plurality of bridgestructures, the electrode connection bridge 3 and the first protectionlayer 4 overlie the metal bridge points 2 successively, both theelectrode connection bridge 3 and the first protection layer 4 arearranged with the via holes corresponding to the metal bridge points 2,and the two electrode blocks 510 at the two ends of each electrodeconnection bridge 3 run respectively through the via holes of the firstprotection layer 4 and the via holes of the electrode connection bridge3, and are electrically connected respectively with the metal bridgepoints; and furthermore the two electrode blocks 510 at the two ends ofeach electrode connection bridge 3 can be electrically connected witheach other through the metal bridge points 2 and the electrodeconnection bridge 3. Furthermore in this touch panel, since the patternof the orthographic projection of the electrode connection bridge 3 onthe substrate has a same shape as the pattern of the orthographicprojection of the first protection layer 4 on the substrate 1, theelectrode connection bridge 3 and the first protection layer 4 can bepatterned using a same mask to thereby dispense with one mask so as tolower the cost of fabricating the touch panel.

As illustrated in FIG. 4 and FIG. 5, in some embodiments, the pattern ofthe orthographic projection of the first protection layer 4 on thesubstrate 1 covers the pattern of the orthographic projection of theelectrode connection bridge 3 on the substrate 1, that is, a contour ofan edge of the first protection layer 4 completely covers a contour ofan edge of the electrode connection bridge 3, so that the electrodeconnection bridge 3 is completely insulated from the second electrode52.

A shape of the pattern of the first protection layer 4 is the same as ashape of the pattern of the electrode connection bridge 3, and thecontour of the edge of the first protection layer 4 completely coversthe contour of the edge of the electrode connection bridge 3; andfurthermore when the first protection layer 4 and the electrodeconnection bridge 3 are patterned respectively using a same mask, a sizeof the resulting contour of the edge of the first protection layer 4 anda size of the resulting contour of the edge of the electrode connectionbridge 3 can be controlled by controlling the amount of exposure so thatthe contour of the edge of the electrode connection bridge 3 iscompletely covered by the contour of the edge of the first protectionlayer 4.

As illustrated in FIG. 4 and FIG. 5, in some embodiments, the touchpanel according to the embodiments of the disclosure further includes asecond protection layer 6 on the touch electrodes, and a pattern of anorthographic projection of the second protection layer 6 on thesubstrate 1 coincides with a pattern of the orthographic projection ofthe touch electrodes on the substrate 1. In some embodiments, the touchelectrode layer can be etched using the second protection layer 6 as amask to thereby form touch electrode structures, so that as comparedwith the fabricating process in the related art, the touch panelaccording to the embodiments of the disclosure can be fabricated whiledispensing with one further mask, and also dispensing with the processesof coating, exposing, etching, and stripping photo-resist (PR) on thetouch electrode layer, and thus avoiding the touch electrodes from beingpeeled in those processes.

Furthermore the touch panel according to the embodiments of thedisclosure further includes a third protection layer on the secondprotection layer 6, and the third protection layer has a full layerstructure, and can isolate the touch electrodes completely from the airto thereby avoid the touch electrodes from being oxidized.

As illustrated in FIG. 1 to FIG. 3, optionally in order to guarantee avisual effect of the appearance of the touch panel, the metal bridgepoints 2 are preferably as small as possible; and in some embodiments,the metal bridge points 2 can be circles with a diameter ranging from 10μm to 15 μm.

Furthermore optionally in order to guarantee circuit connection, a sizeof a via hole of the first protection layer 4 and a size of a via holeof the electrode connection bridge 3 are less than a size of the metalbridge point 2, and in some embodiments, the via holes of the firstprotection layer 4 and the electrode connection bridge 3 can be circularholes with a diameter ranging from 5 μm to 10 μm.

As illustrated in FIG. 1 to FIG. 3, in some embodiments, the touch panelaccording to the embodiments of the disclosure further includes metalwires 20 at the same layer as the metal bridge points 2. In someembodiments, the metal bridge points 2 and the metal wires 20 can beformed in one patterning process without any additional mask andadditional process step.

As illustrated in FIG. 6, in some optional embodiments, a wire electrodelayer 50 at the same layer as the touch electrodes, and a wireprotection layer 60 at the same layer as the second protection layer 6overlie the metal wires 20 successively. The wire electrode layer 50 andthe wire protection layer 60 can protect the metal wires 20 from beingeroded, oxidized, etc., after being exposed to the air for a long periodof time.

Furthermore optionally as illustrated in FIG. 7, the wire electrodelayer 50 and the wire protection layer 60 each has an openings 8 in abonding area of the metal wires 20 to thereby expose the metal wires 20in the bonding area, thus facilitating circuit connection in the bondingarea.

In an some optional embodiments, the wire electrode layer 50 and thetouch electrodes 5 are formed in one etching process, and the wireprotection layer 60 and the second protection layer 6 are formed in onepatterning process, without any additional mask and additional processstep.

As illustrated in FIG. 2 to FIG. 5, in some embodiments, both theelectrode connection bridge 3 and the touch electrodes 5 are transparentelectrodes, and can particularly be ITO electrodes; and both the firstprotection layer 4 and the second protection layer 6 can be insulatingorganic layers, can insulate and protect the ITO electrodes, can beformed in a specific pattern in a patterning process, and will not bestripped.

The touch panel according to the embodiments of the disclosure can befabricated in such a way that the electrode connection bridges 3 and thefirst protection layer can be patterned using a same mask, and the touchelectrode layer is etched directly using the pattern of the secondprotection layer 6 as a mask to form the touch electrodes, so the touchpanel can be fabricated while dispensing with at least two masks tothereby greatly lower the development cost, and also dispensing with theprocesses of coating, exposing, etching, and stripping the photo-resist(PR) on the touch electrode layer to thereby simplify the fabricationprocess, and thus avoiding the touch electrodes from being peeled, tothereby improve the good-yield ratio of the display panel.

The embodiments of the disclosure further provide a display panelincluding the touch panel according to any one of the embodiments above.

The embodiments of the disclosure further provide a display deviceincluding the display panel according to the embodiments above.

Further to the touch panel according to the embodiments above, theembodiments of the disclosure further provide a method for fabricatingthe touch panel, and as illustrated in FIG. 15, the method includes thefollowing steps.

Step S101, forming a metal layer on the substrate 1, and forming themetal bridge points 2 of each of the plurality of bridge structures in afirst patterning process, as illustrated in FIG. 8. In the embodimentsof the disclosure, the “patterning process” refers to process steps offorming a structure in a specific pattern, and can include one or moreof process steps of coating, exposing, developing, etching, and stripingphoto-resist, or can be an imprinting process, an ink-jet printingprocess, or another patterning process of forming a structure in adesirable pattern using a mask in the art.

Step S102, forming a first electrode layer 300 on the metal layer, andforming the electrode connection bridge 3 of each of the plurality ofbridge structures in a second patterning process, as illustrated in FIG.9 to FIG. 11.

Step S103, forming a first organic insulating layer on the firstelectrode layer, and forming the first protection layer 4 of each of theplurality of bridge structures in a third patterning process, asillustrated in FIG. 12. In some embodiments, a mask of the thirdpatterning process is the same as a mask of the second patterningprocess.

Step S104, forming the touch electrodes on the first organic insulatinglayer.

In the method for fabricating a touch panel according to the embodimentsof the disclosure, the electrode connection bridge 3 and the firstprotection layer 4 are patterned using a same ask so that one mask canbe dispensed with to thereby lower the fabrication cost of the touchpanel.

In some embodiments, the metal wires 20 can be further formed in thefirst patterning process in the step S101, that is, the metal layer ispatterned in one patterning process in the step S101 to form the metalbridge points 2 in a touch area and the metal lines 20 around the toucharea, as illustrated in FIG. 1.

In some embodiments, the flow of the step S102 can include: forming anintegral first electrode layer (ITO layer) 300 on the substrate 1 formedwith the metal bridge points 2 as illustrated in FIG. 9, and thencoating, exposing, and developing photo-resist (PR) on the ITO layer 300to form a photo-resist layer 7 with a same pattern of the electrodeconnection bridges 3, as illustrated in FIG. 10; and then etching theITO layer 300 to reserve the ITO layer in a protected area of thephoto-resist layer 7, and to remove the ITO layer in the other area tothereby form the electrode connection bridges 3, as illustrated in FIG.11. In some embodiments, since this is a low-temperature process, andthe ITO material is amorphous, the ITO layer can be etched using weakacid, which cannot etch the underlying metal bridge points 2, so thatthe metal bridge points 2 at the openings of the pattern of thephoto-resist layer 7 can be reserved for circuit connection between thetwo ends of the electrode connection bridges 3. Finally the photo-resistlayer 7 on the electrode connection bridges 3 is stripped so that theelectrode connection bridge 3 is formed.

In some embodiments, the flow of the step S103 can include: forming anintegral organic insulating layer on the substrate 1 formed with theelectrode connection bridges 3 as illustrated in FIG. 12, and thenexposing and developing the organic insulating layer to form the firstprotection layers 4 with a same pattern as the electrode connectionbridges 3, where the first protection layers 4 are also arranged withvia holes matching with the metal bridge points 2, and the shape of thecontours of the edges of the first protection layers 4 is the same asthe shape of the contours of the edges of the electrode connectionbridges 3. In some embodiments, the exposure process of the organicinsulating layer and the patterning process of the electrode connectionbridges 3 use a same mask; and furthermore a size of the resultingcontour of the edge of the first protection layers 4 and a size of theresulting contour of the edge of the electrode connection bridges 3 canbe controlled by controlling the amount of exposure so that the size ofthe contours of the first protection layers 4 is larger than the size ofthe contours of the electrode connection bridges 3, and thus the edge ofthe electrode connection bridges 3 are completely covered by the edge ofthe first protection layers 4.

In some embodiments, the touch electrodes can be formed on the firstorganic insulating layer in the step S104 particularly in the followingsteps:

as illustrated in FIG. 13 and FIG. 14, a second electrode layer 500 isformed on the first organic insulating layer, a second organicinsulating layer is formed on the second electrode layer 500, and thesecond insulating layer is patterned in a same pattern as the touchelectrodes to be formed in a fourth patterning process to thereby formthe second protection layer 6; and

as illustrated in FIG. 4 and FIG. 5, the second electrode layer 500 isetched using the second protection layer 6 as a mask to form the touchelectrodes (the first electrode 51 and the second electrode 52).

In some embodiments, the flow of the step S104 can include: forming theintegral second electrode layer (ITO layer) 500 on the substrate 1formed with the bridge structures as illustrated in FIG. 13, and thencoating, exposing, and developing the organic insulating layer above theITO layer 500 to form the pattern of the second protection layer 6, asillustrated in FIG. 14, where the second protection layer 6 is firstlyformed; and etching the ITO layer 500 using the second protection layer6 as a mask so that the ITO layer is removed in an area thereof which isnot protected by the second protection layer 6, and reserved in theother area thereof protected by the second protection layer 6, asillustrated in FIG. 4 and FIG. 5, thus forming the structures of thefirst electrode 51 and the second electrode 52, where the touchelectrodes are formed. In the flow above, since the touch electrodelayer is etched using the second protection layer 6 instead ofphoto-resist (PR) as a photo-resist protection layer, the touchelectrodes can be formed while dispensing with one mask, and alsodispensing with the processes of coating, exposing, developing, andstripping the photo-resist (PR) layer on the ITO layer 500 to therebysimplify the process, and thus avoiding the first protection layer 4from being partially dissolved while stripping the photo-resist (PR)layer, and consequently the touch electrodes from being peeled.

In some embodiments, after the step S104 above is performed, the methodfurther includes the step of forming a third protection layer with afull layer structure on the second protection layer 6 to thereby isolatethe touch electrodes from the air so as to avoid the touch electrodesfrom being oxidized.

As illustrated in FIG. 6, in some embodiments, the wire protection layer60 overlying the metal wires 20 can be further formed in the fourthpatterning process in the step S104, that is, the pattern of the secondorganic insulating layer includes the wire protection layer 60 inaddition to the second protection layer 6; and furthermore, the secondelectrode layer 500 is etched using the second organic insulating layeras a mask to form the wire electrode layer 50 overlying the metal wires20, that is, the pattern of the second electrode 500 includes the wireelectrode layer 50 in addition to the touch electrodes.

Optionally as illustrated in FIG. 7, both the wire electrode layer 50and the wire protection layer 60 are designed with the openings 8 in thebonding area of the metal wires 20, that is, the wire electrode layer 50and the wire protection layer 60 in the bonding area are etched toexpose the metal wires to thereby facilitate circuit connection in thebonding area.

Evidently those skilled in the art can make various modifications andvariations to the disclosure without departing from the spirit and scopeof the disclosure. Thus the disclosure is also intended to encompassthese modifications and variations thereto so long as the modificationsand variations come into the scope of the claims appended to thedisclosure and their equivalents.

The invention claimed is:
 1. A touch panel, comprising: a substrate;touch electrodes on the substrate, wherein the touch electrodes comprisea first electrode in a first direction and a second electrodeperpendicular to the first direction, and the first electrode comprisesa plurality of first electrode blocks; and a plurality of bridgestructures on the substrate, configured to electrically connect adjacentfirst electrode blocks of the plurality of first electrode blocks,wherein each of the plurality of bridge structures comprises: at leasttwo metal bridge points, and an electrode connection bridge and a firstprotection layer overlying the at least two metal bridge pointssuccessively, wherein the electrode connection bridge comprises viaholes corresponding to the metal bridge points in a one-to-one manner,and a pattern of an orthographic projection of the first protectionlayer on the substrate has a same shape as a pattern of an orthographicprojection of the electrode connection bridge on the substrate; and twoof the plurality of first electrode blocks respectively at two ends ofeach electrode connection bridge run respectively through via holes ofthe first protection layer and the via holes of the electrode connectionbridge, and are electrically connected respectively with the metalbridge points.
 2. A method for fabricating the touch panel according toclaim 1, comprising: forming a metal layer on the substrate, and formingthe metal bridge points of each of the plurality of bridge structures ina first patterning process; forming a first electrode layer on the metallayer, and forming the electrode connection bridge of each of theplurality of bridge structures in a second patterning process; forming afirst organic insulating layer on the first electrode layer, and formingthe first protection layer of each of the plurality of bridge structuresin a third patterning process, wherein a same mask is used in the thirdpatterning process and the second patterning process; and forming thetouch electrodes on the first organic insulating layer.
 3. The methodaccording to claim 2, wherein the forming the touch electrodes on thefirst organic insulating layer comprises: forming a second electrodelayer on the first organic insulating layer, forming a second organicinsulating layer on the second electrode layer, and patterning thesecond organic insulating layer in a fourth patterning process to form asame pattern as the touch electrodes to be formed; and etching thesecond electrode layer using the second organic insulating layer as amask to form the touch electrodes.
 4. The method according to claim 3,wherein metal wires are further formed in the first patterning process.5. The method according to claim 4, further comprising: forming a wireprotection layer overlying the metal wires in the fourth patterningprocess; and etching the second electrode layer using the second organicinsulating layer as a mask to further form a wire electrode layeroverlying the metal wires.
 6. The method according to claim 3, whereinpatterning the second organic insulating layer in a fourth patterningprocess to form a same pattern as the touch electrodes to be formedcomprises: patterning the second organic insulating layer in a fourthpatterning process to form a same pattern as the touch electrodes to beformed to thereby form a second protection layer; wherein etching thesecond electrode layer using the second organic insulating layer as amask to form the touch electrodes comprises: etching the secondelectrode layer using the second protection layer as a mask to form thetouch electrodes.
 7. The method according to claim 6, after forming thetouch electrodes on the first organic insulating layer, the methodfurther comprises: forming a third protection layer with a full layerstructure on the second protection layer.
 8. The touch panel accordingto claim 1, further comprising a second protection layer on the touchelectrodes, and a pattern of an orthographic projection of the secondprotection layer on the substrate coincides with a pattern of anorthographic projection of the touch electrodes on the substrate.
 9. Thetouch panel according to claim 8, further comprising metal wires at asame layer as the metal bridge points.
 10. The touch panel according toclaim 9, wherein a wire electrode layer at a same layer as the touchelectrodes and a wire protection layer at a same layer as the secondprotection layer overlie the metal wires successively.
 11. The touchpanel according to claim 10, wherein the wire electrode layer and thewire protection layer each has an opening in a bonding area of the metalwires.
 12. The touch panel according to claim 8, further comprising athird protection layer with a full layer structure on the secondprotection layer.
 13. The touch panel according to claim 8, wherein theelectrode connection bridge and the touch electrodes are Indium TinOxide electrodes, and the first protection layer and the secondprotection layer are insulating organic layers.
 14. A display panel,comprising the touch panel according claim
 1. 15. A display device,comprising the display panel according to claim
 14. 16. The touch panelaccording to claim 1, wherein the pattern of the orthographic projectionof the first protection layer on the substrate covers the pattern of theorthographic projection of the electrode connection bridge on thesubstrate.
 17. The touch panel according to claim 1, wherein a contourof an edge of the first protection layer completely covers a contour ofan edge of the electrode connection bridge.
 18. The touch panelaccording to claim 1, wherein a size of each of the via holes of thefirst protection layer is less than a size of each of the metal bridgepoints, and a size of each of the via holes of the electrode connectionbridge is less than the size of each of the metal bridge points.